StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks

StarTech.com 20g Tube CPU Thermal Paste Grease Compound for Heatsinks. Thermal conductivity: 1.066 W/m·K, Product colour: White, Thermal resistance: 0.195 °C/W. Width: 72 mm, Depth: 18 mm, Height: 18 mm. Package width: 84 mm, Package depth: 152 mm, Package height: 23 mm
Manufacturer: StarTech
SKU: HEATGREASE20
Vendor: Aspects
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.

Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
  • Legal warranty via the seller
  • 30 days to change your mind — free returns
  • Free delivery from €25
€5.00 incl tax
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The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.

Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics
Products specifications
Features
Thermal conductivity1.066 W/m·K
Product colourWhite
Thermal resistance0.195 °C/W
Specific gravity2.3 g/cm³
Operating temperature (T-T)-20 - 100 °C
Storage temperature (T-T)-50 - 100 °C
Operating relative humidity (H-H)10 - 80%
Weight & dimensions
Width72 mm
Depth18 mm
Height18 mm
Weight24 g
Packaging data
Package width84 mm
Package depth152 mm
Package height23 mm
Package weight37 g
Technical details
Evaporation (@ 200°C/24h)0.001%
Bleed (@ 200°C/24h)0.005%
Compliance certificatesRoHS
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Products specifications
Features
Thermal conductivity1.066 W/m·K
Product colourWhite
Thermal resistance0.195 °C/W
Specific gravity2.3 g/cm³
Operating temperature (T-T)-20 - 100 °C
Storage temperature (T-T)-50 - 100 °C
Operating relative humidity (H-H)10 - 80%
Weight & dimensions
Width72 mm
Depth18 mm
Height18 mm
Weight24 g
Packaging data
Package width84 mm
Package depth152 mm
Package height23 mm
Package weight37 g
Technical details
Evaporation (@ 200°C/24h)0.001%
Bleed (@ 200°C/24h)0.005%
Compliance certificatesRoHS
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